Nordson 4600 Automated BondTester

Improve reliability and throughput while reducing human influence.

The 4600 Bondtester is a benchtop system designed to automatically perform complex test procedures without needing operator input. The system can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.

Applications:

Automatic testing for Battery packs, Leadframe and wafers (<200mm)

Paragon™ – Your automation partner

• Automation assisted GUI
• Build in check list & help
• Multi window views
• Schematic virtual images displayed

Import maps or create your own

• Import wafer map file SINF / G85 / Klarf (AOI) / New Format
• Wire pull and ball shear pattern displays
• Colour gradients indicate different heights
• Inter-die wire corrections

Remove uncertainty - camera assisted programming

• Ultimate accuracy using on-board cameras
• Both high resolution and field of view cameras as standard
• Fiducial images for alignment

Image every failure mode – even with extreme height variations