Product Code: 4600
Brand: Nordson
The Nordson DAGE 4600 Automated Bondtester is a high-precision, automated bond testing system designed to deliver consistent, repeatable mechanical testing across semiconductor, microelectronics, battery and wafer-level applications. Its automated architecture allows complex test procedures to be performed with minimal operator intervention, helping manufacturers improve test throughput, measurement consistency and data traceability.
The DAGE 4600 can automatically perform programmed shear and pull test patterns across different bond orientations, while capturing failure-mode images at the completion of each test. By reducing operator influence, the system helps minimise measurement variation and provides consistent results across production batches.
The 4600 combines precision motion control with automated sample handling, enabling large batches of devices to be loaded, aligned and transferred for testing. The system supports both wafer and strip automatic loading, with wafer OCR and strip identification providing improved sample traceability.
Automated pattern transfer and file import simplify the creation and execution of complex test sequences. Factory communication options, including SECS/GEM and RS-232, allow the system to integrate into automated manufacturing environments.
The DAGE 4600 offers manual operation as well as dual camera-assisted automation, with test forces ranging from 0.01 gf to 50 kgf. Its Multi-Function Cartridge supports pull, shear and component bend testing, providing flexibility for a broad range of applications.
Precision is central to the DAGE 4600 design. Its rapid closed-loop motion system provides 100 nm resolution, while the system offers step-back accuracy of ±0.25 µm and force-dependent system accuracy of approximately ±0.10% to 0.05% FSL.
Integrated Compound Surface Imaging (CSI) with autofocus provides advanced visualisation during testing, while automatic failure-mode identification and wire detection help streamline analysis and reduce reliance on manual inspection.
For microelectronics, the system can be used to test leadframes and strips, package substrates, BGA devices and MEMS components, including applications involving wire pull, ball shear, die shear and surface-mount shear testing.
The 4600 also supports battery bond testing, including wirebond ribbon, busbar and tab-weld connections. Testing can be performed in destructive sample-testing applications or, where appropriate, non-destructive testing environments.
For wafer-level applications, the DAGE 4600 can accommodate wafers from 2-inch through 8-inch, including silicon, glass, laminate, composite, compound and warped wafers. It can also test fine-pitch pillars and bumps below 50 µm, with rotational shear tooling allowing testing in different directions.