Product Code: 4600-W
Brand: Nordson
The Nordson DAGE 4600-W Automated Bondtester is a high-precision, automated wafer-level bond testing system designed to deliver accurate, repeatable and high-throughput mechanical testing of semiconductor wafers and advanced microelectronic devices. The benchtop system is engineered to perform complex shear and pull test patterns automatically, reducing operator influence while improving testing consistency, productivity and data integrity.
Designed specifically for wafer-level applications, the 4600-W can handle wafers from 2-inch through 8-inch sizes, providing a flexible solution for testing silicon, glass, laminate, composite, compound and warped wafers. It is suitable for applications involving advanced semiconductor interconnects, including fine-pitch bumps and pillars, with testing possible in different orientations using the appropriate rotational shear tooling.
Advanced Automated Wafer Testing
The DAGE 4600-W combines automated wafer handling with camera-assisted fiducial recognition, wafer-map import and OCR-based wafer identification. Supported wafer-map formats include SINF, KLARF and G85, allowing test locations to be efficiently defined and processed across the wafer.
Once a test sequence has been initiated, the system can automatically load, align and transfer samples, perform programmed tests and capture failure-mode images. This enables large batches of tests to be completed with minimal operator intervention while maintaining consistent testing conditions.
Precision Measurement and Imaging
The 4600-W incorporates Compound Surface Imaging (CSI) with autofocus to provide detailed surface and topology information during testing. Its Renishaw linear encoder system provides 100 nm resolution, while step-back accuracy is specified at ±0.25 µm and system accuracy at ±0.10% to 0.05% FSL, depending on the measurement range.
The multifunctional cartridge supports combinations of shear and pull transducers, providing flexibility across different wafer-level bond testing applications. Automated failure-mode image capture further enhances test data by providing visual evidence alongside measured mechanical results.
The Nordson DAGE 4600-W Automated Bondtester is ideally suited to semiconductor manufacturers, advanced packaging facilities, research and development laboratories and failure-analysis applications where precise, repeatable wafer-level mechanical testing is critical.
By combining automated sample handling, precision motion control, advanced imaging and comprehensive wafer mapping, the 4600-W helps manufacturers improve reliability, increase throughput and reduce the influence of operator technique. Its automation capabilities also support consistent testing across large batches and provide improved traceability of test results.
The Nordson DAGE 4600-W has an X/Y travel of 450 mm × 410 mm, 75 mm Z travel and force capability of up to 50 kg, with a system footprint of 1075 × 920 × 1000 mm and a weight of approximately 140 kg.