Product Code: 4800-INTEGRA
Brand: 0
The Nordson DAGE BT4800 INTEGRA Plus is a next-generation automated bond testing system developed for the increasingly demanding requirements of wafer-level semiconductor packaging. Combining advanced motion control, vision, wafer handling and high-throughput software, the BT4800 INTEGRA Plus delivers precise, repeatable and fully traceable bond testing for advanced semiconductor manufacturing.
Designed for 200 mm and 300 mm wafers, the BT4800 INTEGRA Plus provides high-throughput testing of micro-bumps and traces across advanced packaging technologies including chip-on-wafer, stacked wafer and molded wafer applications. Its automated architecture enables efficient testing in high-mix production environments while reducing operator intervention and improving measurement consistency.
The BT4800 INTEGRA Plus incorporates a smart load port and wafer chuck to provide smooth, automated wafer handling and rapid changeover between different material types. A fully configurable test interface allows users to create and execute automated test recipes for a wide range of wafer and sample configurations.
The complete system is controlled from a single PC, integrating wafer handling, motion, vision and testing functions into one streamlined platform. This helps maximise throughput while maintaining consistent test conditions and traceability across production batches.
A key advantage of the BT4800 INTEGRA Plus is its ability to accurately test challenging wafer configurations, including thin and highly warped wafers.
The pre-alignment system supports the wafer at its edges to eliminate lateral movement and provide secure positioning during testing. Automatic wafer justification, combined with Nordson's patented Lipseal? technology, enables accurate testing even when wafer flatness presents additional challenges.
Built-in verification and cartridge calibration further support measurement confidence and system accuracy.
The BT4800 INTEGRA Plus can also incorporate Nordson Intelligence capabilities to enhance automated testing and failure analysis.
The AI AutoGrade system uses a library of test images to determine and classify failure points, helping improve classification accuracy while reducing inconsistencies associated with manual operator grading. Automated failure-mode classification can provide faster, more consistent analysis and valuable information for semiconductor process optimisation.
Key Features
The Nordson DAGE BT4800 INTEGRA Plus is engineered for manufacturers working with increasingly sophisticated semiconductor packaging technologies where conventional inspection alone may not provide sufficient information about interconnect integrity.