Nordson Select Cerno 508-1PD Dual Pot Inline Selective Soldering Machine
The Cerna™ 508.1 is a robust selective soldering system delivering the optimum balance between flexibility, throughput and large board size. The Cerno™ 508.1 has many unique features, including combined fluxing, preheating and soldering for easy integration into batch or in-line production.
Versatility
With its flexible configuration, the Cerno™ 508.1 is a versatile selective soldering platform and can be equipped for either single, parallel or double processing. Use of a single dropjet fluxer and solder pot allows soldering of printed circuit boards as large as 508 x 508 mm (20.0 x 20.0 in.).
Cerno™ 508.1PD flux, preheat and solder configuration
The double processing mode allows soldering with multiple size nozzles within the same program enhancing flexibility and increasing productivity. A single drop-jet fluxer and dual solder pots can be used in the double processing mode and is ideally suited for the use of two different solder alloys without requiring physical changing of solder pots.
Value
With a reputation for innovation, comprehensive process solutions from Nordson SELECT ensure a maximum return on investment and low cost of ownership. From initial process development through full-scale production, you are supported by our experienced worldwide engineering, applications development and technical service network.
Standard Features
- Integrated platform with combined fluxing, preheating and single selective soldering station (508.1S)
- SMEMA chain conveyor with positive PCB location
- Automatic conveyor width adjustment
- MicroDrop drop-jet fluxer
- Flux level sensing system
- All titanium solder pot and pump assembly
- Quick change magnetically coupled solder nozzle
- Automatic solder pot level monitoring
- Automatic wave height monitoring
- Heated nitrogen inerting system
- Process viewing camera
- PhotoScan editor and machine control software
- Easy point-and-click programming
- Remote machine control
- Remote machine maintenance
- Network and FIS capability
- TFT monitor
Additional Configurations
Dual MicroDrop drop-jet fluxers and dual solder pot and pump assemblies for parallel or double soldering modes (508.1PD)
Optional Features
- In-process, closed-loop flux verification system for drop-jet control
- Full surface topside infrared preheating
- Full surface bottom-side infrared preheating
- Closed-loop pyrometer control
- Board warpage sensing system
- Dual process viewing camera and second monitor
- Automatic solder wire feeding system
- Automatic solder level sensing system
- Wave height control sensing system
- Automatic solder nozzle cleaning system
- Data logging system with traceability of all process parameters
- Barcode reader
