Two models of Fa23 Printers available to cover complete range of applications
Each model comes as stand-alone with package of selected features
Basic set of adjustable production tooling included
Fa23 Automatic
Stencil frame size max 584x680x40 mm
Stencil frame size min 584x584x18 mm
Print area max 410x390 mm
PCB size max 460x410 mm
PCB size min 50x60 mm
Machine footprint 860x846 mm
Fully automatic stencil to pad alignment
Fa23 Manual
Stencil frame size max 584x680x40 mm
Stencil frame size min 584x584x18 mm
Print area max 410x390 mm
PCB size max 460x410 mm
PCB size min 50x60 mm
Machine footprint 860x846 mm
Manual stencil to pad alignment monitored by software
Features for Precision
Solder paste printing is one of the most important processes in SMT
Fa23 Printers bring on highly precise print
Designed for accurate and repeatable printing
For any electronic application while maintaining low investment costs
Camera Controlled Stencil to Pad Alignment
Stencil-to-board automatic alignment system with unique through-stencil view technology
Two fixed cameras can be positioned over any suitable position of the print area
System can use square solder pads or printable fiducials
Possible exact positioning of PCB under stencil for stencils with reduced apertures
LED illuminates the target area for a crystal clear view through stencil apertures
A laser source attached to each camera speeds up navigation and camera positioning during setup
First print alignment does not require any calibration to define the stencil position
All to do with the new product is to find the proper apertures for alignment, to show them to the system and start print process
Alignment in just a few seconds thanks to fast and reliable table servo-positioning with MAXON drives
Seperation Speed for Distance
Successful snap-off depends on solder paste thixotropy, thickness and dynamics of separation movement
Separation of stencil from PCB is driven by pneumatic-hydraulic system which assures very smooth acceleration of printable separation speed
Important for printing of small chips and high-density PCBs
Slow speed for precise separation is programmable as well as the necessary adjustable snap-off distance, so the separation accelerates as soon as possible to minimize PCB removal time
After finishing alignment, the PCB-to-stencil position remains without any movement which assures the highest long-term stability of print accuracy
Drawer with Underside Cleaning
Fully telescopic drawer carries all the clapming for quick PCBA changes
