Nordson Select Integra 508-4 4 Zone Selective Soldering Machine
The Integra™ 508.4 is a multi-station selective soldering system designed for high-volume applications with maximum throughput. The Integra™ 508.4 has many unique features, including concurrent fluxing, preheating and soldering for faster processing time and reduced soldering cycle.
Versatility
With its flexible configuration, the Integra™ 508.4 is a versatile selective soldering platform and can be equipped for either single, parallel or double processing. Use of a single dropjet fluxer and solder pot allows soldering of printed circuit boards as large as 508 x 508 mm (20.0 x 20.0 in.).
Integra™ 508.4S Configuration
When configured with dual drop-jet fluxers and dual solder pots, the Integra™ 508.4 can be used in two different modes and is capable of processing up to 8 boards at one time. The parallel processing mode enables fluxing and soldering of two printed circuit boards at the same time doubling machine productivity.
Value
With a reputation for innovation, comprehensive process solutions from Nordson SELECT ensure a maximum return on investment and low cost of ownership. From initial process development through full-scale production, you are supported by our experienced worldwide engineering, applications development and technical service network.
Standard Features
- Four-zone operation with independent zones for concurrent fluxing and preheating plus two selective soldering stations (508.4S)
- SMEMA chain conveyor with positive PCB location
- Automatic conveyor width adjustment
- MicroDrop drop-jet fluxer
- Flux level sensing system
- Full surface bottom-side infrared preheating
- All titanium solder pot and pump assembly
- Quick change magnetically coupled solder nozzle
- Automatic solder pot level monitoring
- Automatic wave height monitoring
- Heated nitrogen inerting system
- Process viewing camera
- PhotoScan editor and machine control software
- Easy point-and-click programming
- Remote machine control
- Remote machine maintenance
- Network and FIS capability
- TFT monitor
Additional Configurations
Dual MicroDrop drop-jet fluxers and dual solder pot and pump assemblies for parallel or double soldering modes (508.4PD).
Optional Features
- In-process, closed-loop flux verification system for drop-jet control
- Full surface topside infrared preheating
- Closed-loop pyrometer control
- Board warpage sensing system
- Dual process viewing camera and second monitor
- Automatic solder wire feeding system
- Automatic solder level sensing system
- Wave height control sensing system
- Automatic solder nozzle cleaning system
- AOI solder joint inspection system
- Data logging system with traceability of all process parameters
- Barcode reader
