Product Code: Paragon
Brand: Nordson
Advanced Bond Testing Software for Precision, Automation and Data Analysis
Nordson DAGE Paragon? Software is an advanced bond testing software platform designed to simplify and enhance the operation of Nordson DAGE bond testing systems. Combining an intuitive user interface with powerful automation, data analysis, diagnostics and reporting tools, Paragon provides engineers and operators with greater control over bond testing processes while helping deliver consistent, repeatable and traceable results.
Developed for demanding semiconductor, microelectronics and electronics manufacturing applications, Paragon supports both straightforward manual testing and sophisticated automated test sequences. Its configurable interface allows test parameters, automation patterns and analysis functions to be managed efficiently from a single software environment.
Paragon has been designed around a clear, tab-based interface that provides quick access to frequently used functions and test settings. A structured workflow helps simplify operator training and allows authorised users to configure test parameters while restricting access to critical settings when required.
Test patterns can be saved alongside device images, allowing operators to quickly identify and select the appropriate test sequence. This can help reduce setup time and improve consistency between operators and production shifts.
Paragon provides powerful automation capabilities for testing multiple bonds across devices, lead frames and complex assemblies. Operators can define test points, positions and pitch to automatically progress through a sequence of bonds, reducing manual intervention and improving testing efficiency.
For larger or more complex lead frames, the Device Matrix function allows a single device pattern to be programmed and then replicated across the complete frame arrangement. This is particularly useful where thousands of test positions may need to be generated from a common device configuration.
Paragon Automation also provides a visual representation of test patterns, including wire, bump and die locations. Test sequences can be reviewed and edited offline, with wire-pull animations providing visibility of test order, test type and offsets before the sequence is executed on the bond tester.