Nordson Spectrum II S2-900 Precision Fluid Dispensing System The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs Consistent machine quality and reliability with the worldâ??s preferred, fully-automated fluid dispensing system High board density and minimal wet-out distances enabled by market-leading total system wet dispense accuracy Production quality is assured by Nordson ASYMTEKâ??s patented closed-loop process controls Reduce manufacturing costs with higher throughput from precision dual-simultaneous dispensing Easily switch between multiple dispensing applications with the highly scalable, modular design &) ;Dispensing underfill in-line with the Spectrum II reduces manual handling and gives a more uniform result, a more efficient SMD manufacturing process, and better yield. &) ; - Mr. Elvin Solberg, Manufacturing Engineering Manager for ReSound Nordson ASYMTEK continues to set the industry standard with the Spectrum II automated fluid dispensing system. ASYMTEK leverages over 30 years of experience with precision fluid delivery in the design refinements of the Spectrum II system to maximize their customersâ?? profitability with a small footprint, high productivity system that is also highly scalable and easily adapted to a wide variety of dispensing applications. The low mass, highly accurate motion system leads the market in achieving total system X-Y wet dispense accuracy and integrates precision Z-axis control to ensure consistent line widths when dispensing with single or dual simultaneous valves. Higher consistency leads to higher yield and higher yield leads to maximum profitability. New features and upgrade options for the Spectrum II systems continue to expand upon the wide range of applications. Whether it is dispensing underfill in PCBAapplications, precise coating on mobile electronics and flexible circuits, solder paste sealing lines, or hot melt adhesive in case assembly applications, Spectrum II fluid dispensers are the globally preferred systems for mass production. Features Calibrated Process Jetting (CPJ) Non-Contact Height Sensor Fids-on-the-Fly Software Continuous Path Motion Multiple Valve Types (Jets, Augers, Time-Pressure, etc.) Multiple Applications (underfill, cavity fill, die attach, precision coating, encapsulation, hot-melt/PUR, and more) Fluidmove® software High-Resolution Monocle Vision Package- optional Dual-Action Dispensing - optional Dual-Simultaneous Dispensing;- optional Tilt Dispensing: Single-Axis and Programmable Tilt + Rotate - optional Dual-lane Dispensing for increased throughput - optional Pre-/Dispense/Post-heating to enhance underfill flow-out and curing - optional    Class 100 cleanroom-compliant design - optional
