Nordson TRAK Automated Series Plasma System

The Nordson MARCH TRAK^® series of gas plasma cleaning equipment provides unparalleled treatment uniformity and process consistency

The TRAK series plasma system delivers superior plasma treatment quality and automation in one very configurable platform, resulting in high-throughput plasma processing and plasma cleaning for semiconductor and electronics packaging. The plasma chamber is capable of processes such as dielectric etch, photoresist descum/ash, oxide removal, organic contamination clean and surface activation, depending upon chamber kit and electrode configuration.

TRAK systems support manual and automated operations (with inline or built-in handler), SMEMA and SECS/GEM communications protocol, and remote user interface. The versatile, exceptionally uniform, and compact chamber design allows for interchangeable processing configurations and plasma modes - direct, RIE, downstream, and IFP (ion-free plasma) plasma treatment options.

A three-axis symmetrical plasma chamber ensures that all positions of the product are treated uniformly while tight controls over all process parameters ensure repeatable results from product to product.

• The TRAK‘s small plasma chamber volume and proprietary plasma process control enable unmatched short cycle times, while its slim structure minimizes floor space requirements.
• The TRAK‘s universal architecture handles a wide variety of product form factors, including boats, carriers, Jedec/Auer^® boats, strips, laminates, and wafers.
• Depending on throughput and product form requirements, the system can be configured for magazine-to-magazine processing of single and multiple strips or lead frames, wafer processing, and standalone for island-based production environments.
• The TRAK‘s SMART^® Tune management system provides closed-loop plasma control that optimizes the RF system and minimizes tuning time. The system automatically recycles to a plasma-ready state, compensating for changes in vacuum pressure, temperature and varied lot sizes. Maximum power to the chamber is achieved in seconds with a proprietary algorithm that constantly measures forward and reflective power inside the chamber.

Features and Benefits

• Ultimate application flexibility for direct, downstream and ion-free (patented) plasma, which allows treatment without exposure to ion and UV
• Easily integrates with a variety of process equipment, including wire bond, die attach, dispense, mold, and marking
• Slim structure that requires minimal floor space, all service components are easily accessible from the front
• Compact, three-axis symmetrical chamber and proprietary process control for unmatched process uniformity
• Industry leading throughput capacity with short cycle times