Nordson VIA High Volume Series Plasma System

Nordson MARCH‘s VIA^™ series delivers superior plasma treatment uniformity for etch-back, desmear and surface activation of large flexible or rigid panels during PCB manufacturing

Plasma treatment uniformity is a key operational requirement in desmear and etchback applications for HDI, flexible and rigid circuit board manufacturing. Plasma can deliver higher uniformity and reproducibility than chemical or mechanical processes. The VIA series plasma treatment systems utilize a patented plasma technology to produce superior uniformity at high throughputs.

The VIA series for large-panel plasma processing is available in various chamber sizes, with choice of vertical or horizontal panel configurations. Custom configurations are available for large and thick panel requirements.

• Patented, industry-proven plasma technologies provide superior surface treatment uniformity, prior to lamination, to improve adhesion and reliability
• Efficient design, economical gas consumption, small footprint, and attractive system pricing all contribute to a low cost of ownership
• Easy loading and versatile racks allow for maximum throughput
• Single-stage plasma process and capacity options to enable excellent throughput for a wide range of PCB manufacturing requirements

Models and Configurations

FlexVIA^™-Plus Plasma Treatment System: The FlexVIA-Plus has a larger plasma chamber than the FlexVIA plasma system. Its advanced horizontal electrode design, with integrated rack, provides optimum material alignment, while the dual-rack chamber accommodates up to thirty 20 &) ; x 24 &) ; panels in a single cycle, enabling rates of 140-200 units per hour (UPH).

RollVIA^™ Plasma Treatment System: