CIF VS-500-V Vapour Phase Soldering MachineThe design of the machine allows to solder even the most complex cards with a format of max. 500 x 500 x 60 mm while ensuring optimal quality thanks to:
- The inert atmosphere resulting from the fluid (medium) used
- An incomparable temperature delta across the entire component
- No possible handling error during the cycle
The VS-500-V is the upgraded model to the VS-500-IV. It has the following improvements:
- A high efficiency chiller included
- It can go up to 10 temperature levels
- ESD paint
- ESD top glass
- Display of the real-time reflow profile integrated into the machine
- Light signal column
The main applications relate to lead and lead-free soldering of all types of boards even the most complex, conductive adhesives and repair.
The concept of the vapor phase allows:
- Reducing fluid consumption (medium) using a unique vapor recovery system; this greatly reduces production costs
- Quick return on investment and high capacity for mixed productions
- Optimum soldering quality in inert atmosphere and vacuum (without void)
- Compensation for pressure fluctuations in the tank
- Minimum temperature delta throughout the working area - not achievable with other technologies
- Reduced energy consumption
- Sub-assembly repair: desoldering and resoldering
- High reliability for all types of soldering
- Precision and repeatability
- Possibility of brazing large format 500 x 500 x 60 mm cards in a small footprint
Technical Characteristics:
- Max PCB dimensions: 500 x 500 x 60 mm
- Max. Load capacity: 2 Kg
- Medium capacity: 5 Kg
- Dimensions (L x l x H): 830 x 775 x 1140 mm
- Installed power: 7.5 KW / H
- Power supply: 3 x 400 V + N / 50 Hz
